| 2009. 12 | Raised 30 billiion won of BW from institutional investors |
|---|---|
| 2009. 11 | Received Best Supplier Award from Samsung Electronics |
| 2008. 12 | Selected as a Global Leading Products(Memory Module PCB, BOC) and Manufacturer by Ministry of Knowledge Economy |
| 2008. 06 | Started a massive-scale supply to Toshiba |
| 2007. 11 | Selected as an IR Excellent Company for 2 years in a row(2006~2007) by Korean IR Service |
| 2007. 11 | Received US$300 Million Export Award on 44th Trade Day |
| 2007. 10 | Received the first Local Entrepreneur Award from the Chungbuk Province |
| 2007. 10 | Received Excellent Cooperating Company Award from Hynix in its Partner's Day |
| 2007. 09 | Factory #5 in full production |
| 2007. 06 | Started a long-term supply to Elpida |
| 2006. 11 | Received US$200 Million Export Award on 43th Trade Day, Decorated Bronze Industrial Medal from the government |
| 2006. 07 | Received Excellence Award in the 5th Technology Fast 50 Korea 2006 |
| 2005. 08 | Factory #4 in full production(Ochang) |
| 2005. 07 | Raised 5 billion won from Samsung Electronics in Korea |
| 2004. 11 | Received US$10 Million Export Award on 41th Trade Day, Decorated Iron Industrial Medal from the government |
| 2004. 05 | Contract with LG Electronics to supply build-up boards |
| 2004. 04 | Contract with SamsungTechwin to supply CSP |
| 2003. 12 | Strategic Alliance with STATS-supply and investment |
| 2003. 09 | Selected by Nanya as a major vendor |
| 2003. 07 | Factory #3 in full production |
| 2003. 04 | Long term contract with Graphic PLC in UK |
| 2002. 05 | Completion of joint development of flip chip build-up BGA with CMK in Japan |
| 2002. 04 | QS 9000 Certificate acquired |
| 2001. 08 | Strategic alliance with Tessera, Inc. of the U.S. for joint technology development |
| 2001. 07 | Patent application filed for design of stacked wCSP package structure |
| 2001. 07 | Patent application filed for PCB design to form Cu land for heat emission under wCSP structure |
| 2001. 07 | Patent application filed for rigid board design to prevent die tilt in CSP packaging |
| 2001. 04 | Patent applications filed in the US for PCB cleansing technology using plasma under normal circumstance |
| 2001. 02 | Agreement on the development of Flip Chip build-up BGA with CMK in Japan |
| 2000. 07 | Strategic alliance with Rambus Inc. of the U.S. for joint technology development |
| 2000. 07 | Strategic alliance with CMK of Japan for joint technology development |
| 2000. 04 | Invested in Skion of the U.S. and signed into technological partnership |
| 2000. 04 | Purchased land for factory expansion of 2.3 acres |
| 2000. 01 | Agreement with Rambus Inc. for joint use of trademarks |
| 2000. 01 | Initial public offering (IPO) on KOSDAQ exchange |