SPS(Semiconductor Package Substrate)
以微细回路的高密度电路板,半导体动态信号连接到主机的半导体的工艺工程核心部件.
使用在具有信赖性的各种移动设备automotive.
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Overview
- FC-CSP (Flip Chip CSP)
- 代替现有的钢丝bonding,与芯片bonding pad位置相同在基板上做bumping pad, 倒装芯片bumping连接 CSP
比起现有的钢丝bonding方法 具有跨时代意义的改进和提高, 电线bonding环没有高度以小面积可提高芯片SMT密度
倒装芯片bump pitch 150 µm 以下bump形成及bump平整度(coinning)技术, 微细电路形成, 表面处理等为主要核心技术 - ETS (Embedded Trace Substrate)
- 电路模式绝缘层内填埋实现超细电路 (High Density I/0)
及提供高信赖性基板SAP式样用MSAP实现同等以上的细微电路 (Line/Space 10/10µm @MSAP)
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Core Technology
- Fine Pattern formation
- Tight solder resist position tolerance
- Flip Chip Bumping Technology
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Specifications
Description Mass Development Patterning Trace L/S(@PSAP) 12/12 10/10 & 8/8 Flip Chip Bump Peripheral 40/80 30/60 Area 140,130 120 Solder Position Tol. ± 12.5 ± 10 Surface Treatment Ni/Au+OSP ENEPIG ← -
Product Image
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FC-CSP (Flip Chip CSP)
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ETS (Embedded Trace Substrate)
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Application
- PC/Server : DRAM, SRAM
- Smart Mobile Devices : AP, Baseband, Finger print sensor, etc.
- Network : Bluetooth, RF, etc.