SPS(Semiconductor Package Substrate)
以微细回路的高密度电路板,半导体动态信号连接到主机的半导体的工艺工程核心部件.
使用在具有信赖性的各种移动设备automotive.
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Overview
- SiP (System in Package)
- 在Substrate Package内安装多个IC和Passive Component,实现一个系统的产品称为SiP。
- 作为与Wearable和Smartphone的RF(射频)、Power等相关的Component的基板,要求亚基具有较高的可靠性和光通量进行信号传输。
- Application
- RF SiP, Wifi, Bluetooth, IoT, Networking, PMIC, AiP
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Core Technology
- Pattern Process : MSAP
- High Layer
- Coreless Technology
- Various Body Size (Small~Large)
- Layer to Layer Alignment
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Specifications
Coreless HVM
(HVM Ready)Sample Layer & Thickness
(Coreless)3L 109µm ← 4L 110µm ← 5L 196µm ← 6L 192µm ← 7L (291µm) ← 8L (296µm) ← 9L (320µm) ← 10L (420µm) ← Via/Pad IVH
(≤40µm Core)50/90 50/85(± 17.5) BVH
(≤25µm PPG)50/80 40/65(± 12.5) Alignment (A/R less) ← Surface finish OSP(Tamura), Ni/Au+OSP, ENIG/ENENIG ← -
Product Image