SPS(Semiconductor Package Substrate)
以微细回路的高密度电路板,半导体动态信号连接到主机的半导体的工艺工程核心部件.
使用在具有信赖性的各种移动设备automotive.
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Overview
- Automotive Substrate
- 随着电子配件需要不断的增加，因此出现了要求产品的高可靠性的无人驾驶汽车用 Substrate。
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Core Technology
- Fine Pattern (for Processor Only)
- High-Reliailbity and Quality
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Specifications
Description Mass Development Patterning Trace L/S(@PSAP) 12/12 10/10 & 8/8 Bump Peripheral 40/80 30/60 Area 140,130 120 Solder Position Tol. ± 12.5 ± 10 Surface Treatment Ni/Au+OSP
ENEPIG← -
Product Image
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Application
- Infotainment System (Processor, Connectivity, etc.)
- ADAS (Image Sensor, Radar, Lidar, etc.)