- 2024
-
- 12
- SIMMTECH (XI'AN) exceeds 1 Billion CNY in production value
- 2022
-
- 12
- Factory #9 in full production
- 2018
-
- 11
- ISO 45001 Certificate acquired
- 01
- IATF 16949 Certificate acquired
- 2015
-
- 07
- Holding Companies(SIMMTECH Holdings) incorporated affiliates
- 2011
-
- 06
- SIMMTECH(XI'AN) Co., Ltd. in full production
- 2010
-
- 09
- SIMMTECH(XI'AN) Co., Ltd. raised US$30 Million from investors
- 07
- Established SIMMTECH HongKong Holdings and China plant, SIMMTECH ELECTRONICS (XI'AN) Co., Ltd.
- 2009
-
- 12
- Raised 30 billiion won of BW from institutional investors
- 2008
-
- 06
- Started a massive-scale supply to Toshiba
- 2007
-
- 09
- Factory #5 in full production
- 06
- Started a long-term supply to Elpida
- 2005
-
- 08
- Factory #4 in full production(Ochang)
- 07
- Raised 5 billion won from Samsung Electronics in Korea
- 2004
-
- 12
- ISO 14001 Certificate acquired
- 05
- Contract with LG Electronics to supply build-up boards
- 04
- Contract with SamsungTechwin to supply CSP
- 2003
-
- 12
- Strategic Alliance with STATS-supply and investment
- 09
- Selected by Nanya as a major vendor
- 07
- Factory #3 in full production
- 04
- Long term contract with Graphic PLC in UK
- 2002
-
- 05
- Completion of joint development of flip chip build-up BGA with CMK in Japan
- 04
- QS 9000 Certificate acquired
- 2001
-
- 08
- Strategic alliance with Tessera, Inc. of the U.S. for joint technology development
- 07
- Patent application filed for design of stacked wCSP package structure
- Patent application filed for PCB design to form Cu land for heat emission under wCSP structure
- Patent application filed for rigid board design to prevent die tilt in CSP packaging
- 04
- Patent applications filed in the US for PCB cleansing technology using plasma under normal circumstance
- 02
- Agreement on the development of Flip Chip build-up BGA with CMK in Japan
- 2000
-
- 07
- Strategic alliance with Rambus Inc. of the U.S. for joint technology development
- Strategic alliance with CMK of Japan for joint technology development
- 04
- Invested in Skion of the U.S. and signed into technological partnership
- Purchased land for factory expansion of 2.3 acres
- 01
- Agreement with Rambus Inc. for joint use of trademarks
- Initial public offering (IPO) on KOSDAQ exchange
- 1999
-
- 08
- Factory #2 in full production
- 05
- Raised 26 billion won from Hangang Restructuring Fund
- 03
- Raised US$22 Million in equity-based initial foreign funding from AIG in the U.S.
- 1998
-
- 06
- CEO delivered a representative speech to American Venture Investment in NewYork
- 1997
-
- 01
- SIMMTECH 2000 VISION
- 1996
-
- 12
- Received 100PPM Certificate
- 09
- First BGA(Ball Grid Array) production line completed in Korea
- 06
- Raised 1.5 billion won from Amkor in Korea
- 03
- Selected as model company for factory automation
- 1995
-
- 02
- Company name changed to SIMMTECH Co., Ltd.
- 1994
-
- 05
- BIB(Burn-in Board) production line completed
- 01
- ISO 9002 Certificate acquired
- 1993
-
- 07
- Research Center established
- 1988
-
- 09
- Completion of first manufacturing facility
- 1987
-
- 08
- Established as Chung-Buk Electronics, the predecessor of SIMMTECH