SPS(Semiconductor Package Substrate)
以微细回路的高密度电路板,半导体动态信号连接到主机的半导体的工艺工程核心部件.
使用在具有信赖性的各种移动设备automotive.
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Overview
- WBCSP (Wire Bond Chip Scale Package)
- 半导体芯片的大小为基板面积的80%以上,用Gold Wire连接芯片和基板的产品称为WBCSP。
- 通过Chip Stack可实现Multi Packaging,因此广泛用于要求小型化的移动设备Memory Chip Packaging。
- Application
- Mobile Memory (LPDRAM/mobile NAND), SSD用 NAND
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Core Technology
- Pattern Process : Tenting, MSAP
- Thin Substrate
- Cored / Coreless
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Specifications
HVM Sample Layer/Thickness/
CCL Thickness2L 100µm 40µm 94µm 30µm 3L 80µm (Coreless) 70µm (Coreless) 4L 120µm 35µm, 30µm 110µm 30µm Trace Pitch
(Width/Space)Tenting 50pt (25/25) ← MSAP 40pt (20/20) ← B/F Pitch
(Width/Space)Tenting 60pt (25/10) 50pt (20/10) MSAP 60pt (30/15)
55pt (25/15)50pt (25/10)
45pt (20/10)SR LPSR AUS308, AUS320 ← DFSR SR1, MG3, MG1_Z, AUS410, SR3 ← Material Low CTE, Low Stress ← -
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