SPS(Semiconductor Package Substrate)
以微细回路的高密度电路板,半导体动态信号连接到主机的半导体的工艺工程核心部件.
使用在具有信赖性的各种移动设备automotive.
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Overview
- FCCSP (Flip Chip Chip Scale Package)
- Chip通过Bumping代替Wirebonding连接到Substrate的产品称为FCCSP。
- 与使用Gold Wire的WBCSP相比,电信号的移动路径更短,性能更优秀,可以形成很多Bump,可以应对高密度半导体。
- Application
- Mobile AP, RCD/DB, SSD Controller, Automotive
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Core Technology
- Pattern Process : MSAP, ETS, PSAP
- Pre-solder
- Fine Pitch
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Specifications
HVM Sample Layer ETS 2L ~ 4L 5L ~ 6L MSAP 2L ~ 8L 10L Trace Pitch (Width/Space) ETS 7/10 6/8 MSAP 15/15 9/12 PSR DFSR SR1, AUS410 ← LPSR AUS320, AUS308 ← Surface Finish Hybrid Ni/Au, OSP, ENEPIG ← Non-Hybrid Selective OSP
(Ni/Au+OSP)Selective OSP
(Ni/Au+OSP)
Selective ENEPIG
(ENEPIG+OSP)Pre-Solder Type MMP, Micro-ball ← -
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