SPS(Semiconductor Package Substrate)
以微细回路的高密度电路板,半导体动态信号连接到主机的半导体的工艺工程核心部件.
使用在具有信赖性的各种移动设备automotive.
-
Overview
- Slim-FCBGA (Slim Flip Chip Ball Grid Array)
- 为了应对高度集成的半导体芯片,是高密度Substrate,通过Flip芯片Bump连接。
- 本公司使用基于BT的原材料，可生产薄且电气特性优秀的FCBGA，故将其命名为Slim-FCBGA。
- 需要Large Body Size、高多层技术来应对High Performance Computing。
- Application
- Consumer SoC
-
Core Technology
- Pattern Process : MSAP, ETS, PSAP
- Pre-solder
- Singulation
- Large Body Size
- High Layer & Thick Thickness
-
Specifications
HVM Sample Layer 2L ~ 10L 14L Singulation Singulation
(Inhouse)← Unit Size 30x30µm 50x50µm Trace Pitch (Width/Space) MSAP 30pt (15/15) 24pt (12/12) PSAP 24pt (12/12) 21pt (9/12) Pre-Solder Type MMP, Micro-ball ← Pitch 120 90 Pre-Solder MMP, Micro-ball ← -
Product Image
