SPS(Semiconductor Package Substrate)
以微细回路的高密度电路板,半导体动态信号连接到主机的半导体的工艺工程核心部件.
使用在具有信赖性的各种移动设备automotive.
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Overview
- CSP (Chip Scale Package)
- 随着汽车电装化(Electrification)的快速进行,部分半导体芯片正在从Leadframe转变为Substrate Packaging。
- 要求具有稳定的散热性能，可靠性高。
- Application
- Automotive (MCU, Power Discrete)
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Core Technology
- Pattern Process : Tenting
- Thick Cu
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Specifications
HVM (HVM Ready) Sample Layer & Thickness 2L 520µm ← 4L 330µm ← Line/Space
(Tenting)Cu T 15u 60pt (15/15) ← Cu T 30u 135pt (40/30) ← Line/Space
(MSAP)Cu T 15u 40pt (20/20) ← Cu T 30u 65pt (30/35) ← PSR AUS320, AUS308 ← Surface Ni/Au, ENEPIG ← -
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